TTU918-General Purpose Paste Soldering Flux

• Excellent flux for joining copper to copper and copper to brass
• Not recommended for electrical or electronic applications
• Effective to 700°F
• Meets Fed. Spec. 0-F 506C, Type 1, Form A and MIL-S-6872A

Specifications

• Container Type: Jar

Additional Specifications

• Size: 4 oz.